- * Automatic bin sorting system for single bin & multi bin.
- * Quickly change tape frame design.
- * Output Feeder stage for 82 and 122 is changeable.
- * Wafer mapping function is available.
- * Wafer /Carrier available, kit exchange easily.
- * High speed and reliable linear Pick & Place module.
Automatic Die Sorer：KS-850
 |
張欽華 |
T:886-2-22682216 #2001 |
| 規(guī)格 | |
|---|---|
|
Accuracy |
X,Y=±50μm,θ=±0.2° |
|
chip size |
0.6x0.6mm~25x25mm |
| Wafer Size | >12" Standard(8" Option) |
|
Input Wafer Load/Unload |
Automatic |
|
Output Wafer Load/Unload |
Automatic |
|
Automatic bin sorting system |
Single bin/Multi Bin |
| Mapping | Easy mapping/File mapping/Barcode reader(Option) |
| Cycle Time | ≤0.5 sec(Excluding pick and place delay time) |
| Tack Time(for wafer change at unloader) | ≤10 sec |
|
|
